Adhesives and Threadlockers
by Pacer

THREADLOCKERS

For use in the threadlocking, sealing, joining and fastening of metal components.ISL series will perform well on platings, stainless steel and plastic fasteners. ANL series is used on metal components only for threadlocking, sealing and joining. Meets MIL-A-4605C.

PART NO. COLOR STRENGTH APPLICATION
ISL-22 Purple Low Removable for locking/sealing small screws under 1.4" in diameter. May be disassembled.
ISL-42 Blue Medium Removable general purpose adhesive for locking/sealing fasteners over 1/4" in dia. May be disassembled.
ISL-71 Red High Permanent for locking. Sealing fasteners up to 1" diameter. Disassembly difficult.
ISL-77 Red High Permanent locking/sealing large bolts and studs for fasteners 1" in diameter and larger. Disassembly difficult; heat required.
ISL-90 Green High Penetrating permanent, for locking/sealing preassembled fasteners. Use to seal weld and casting porosity. Disassembly difficult.
ANL-22 Purple Low Removable for locking/sealing screws under 1/4" diameter. May be disassembled.
ANL-42 Blue Medium Removable general purpose adhesive for locking/sealing fasteners over 1/4" diameter. Disassemble with hand tools.
ANL-71 Red High Permanent for locking. Sealing fasteners up to 1" diameter. Disassembly difficult.
ANL-77 Red High Permanent locking/sealing large bolts and studs for fasteners 1" in diameter and larger. Disassembly difficult; heat required.

EPOXIES
For all electronic applications

PART NO. VISCOSITY APPLICATION
High Strength
ER1001 High Thixotropy paste formulation for use on vertical surface where stay in place adhesion is required.
ER1002 Medium Moderate thixotropy suitable for application with stay in place adhesion is required.
ER1003 Low Syrup like consistency suitable for application requiring a thin glue line and self-leveling characteristics.
General Purpose
ER1100 19,000 cps Use to bond steel, ceramic and dissimilar products.
Thermally Conductive
ER1210 60,000 cps Two part, thermally conductive suitable for PCB and power supplies.
Encapsulating Resin
ER2020 Low Resin system designed for the potting and encapsulation of miniaturized electronic components. Moisture resistant.
ER2045 Very Low General purpose epoxy resin system for potting and encapsulation and impregnation. This unique polymer cures to a glossy, bubble-free casting impervious to moisture, chemicals and solvents.
ER2060 Medium Recommended for the encapsulation and potting coils, capacitors, chokes, and other electronic assembly applications.
smt_adhesives.gif (11772 bytes)SMT ADHESIVE
The SMT-150 is a single part, heat cure, solvent-free adhesive designed for high speed applications and very small devices such as 0402 capacitors. It will perform exceptionally well on surface mount technology and rigid circuit applications. SMT-150 is easily repairable by heating the joint with a soldering iron. It can be dispensed by syringe, pin transfer or screen printing. The product exhibits outstanding adhesion on a variety of rigid dispensing systems. It comes in dark red color and cures in 3 minutes @ 125°C.
Part No. SMT-150

 

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