Solder Specialty Products
By Qualitek |
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Ball
Grid Array (BGA)
Ball Grid Array packages (BGA) have single or multi-layered organic bodies with
solder spheres forming the electrical and mechanical bridge between the package and the
board assembly. Solder spheres are manufactured using a new technology where spheres are
monitored and controlled with +/- 0.001” tolerance.
Please call for more Details |
| TYPE OF BGA |
ALLOY |
BALL DIAMETER |
| PBGA |
Sn63/Pb37
: Sn62/Pb36/Ag2 : LF88 |
0.030" |
| CBGA |
Sn10/Pb90
: Sn10/Pb88/Ag2 |
0.025" |
| TBGA |
Sn10/Pb90 |
0.035" |
|
|
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CEASOLDER
(PEELABLE SOLDER
MASK)
Ceasolder is a high temperature resistance solder mask designed to mask metal surfaces
from molten solder during a wave soldering process. Easily applied by dipping, brushing or
dispensing through pneumatic dispensing equipment or direct from the applicator bottle.
Part No. CSOLDER-1P (1
Pint Container)
Part No. CSOLDER-1G (1 Gallon Container) |
|
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TIP TINNER
Very effective for retinning and cleaning soldering tips. Available in several
alloys, including Sn63/Pb37and Sn62/Pb36/Ag2. Composed of alloyed powder and a deoxidant
to remove oxides from the soldering tips.
Part No. Tip
Tinner |
|
PASTE FLUX
These products may be applied by screening, stenciling or dispensing. Any of these
formulations may be used for touch-up soldering, PPT boards and BGA packages. Paste Flux
comes in three formulations:
| PF600 |
PF700 |
PF200 |
| No-Clean |
Water-Soluble |
RMA |
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Tel#:
310-787-8346/Fax: 310-787-0854
Tel#: 1-800-882-8665 /Fax: 1-800-625-2399
© Copyright 1999 by INTERSTATE GROUP, Inc.
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