Lead Free Composition
Several lead free solders have been specified as alternatives for sn/pb alloys
used in electronics assembly operations. These alloys
exceeds the impurity requirements of J-STD-006 and all other relevant international
standards.
Lead Free Powder
Electronic grade solder powders are available in Type
2 (75-45um), 3 (45-25um), 4 (38-20um), and 5 (25-15um) J-STD-005 powder distribution.
Solder powder distribution is measured utilizing laser diffraction, optical
analysis and sieve analysis. Careful control of solder powder manufacturing
processes ensures
the particle shape is 95% spherical minimum (aspect ration<1.5) and the
powder contains a typical maximum oxide level of 80ppm
Lead Free Solder Pastes
Fluxing activity levels promote thermal stability and prevent thermal degradation
when reflowing under air atmosphere (normal). Since use of nitrogen is not
required, this lead free solder pastes provide excellent cost savings.
Formulations exhibit superior joint strength, excellent wettability, and extraordinary
print
definition and tack life. No-clean post solder residues are non-conductive,
non-corrosive and highly insulated
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